1. Which gives scalable design rules?
a) lambda rules
b) micron rules
c) layer rules
d) thickness rules
Explanation: Lambda rules gives scalable design rules and micron rules gives absolute dimensions.
2. Devices designed with lambda design rules are prone to shorts and opens.
a) true
b) false
Explanation: Lambda design rules prevent shorting, opens, contact from slipping out of the area to be contacted
3. Area A of a slab can be given as ____________
a) t * W
b) t / W
c) L * W
d) L * t
Explanation: Area A of a uniform slab is given as the product of thickness t and width W of the slab. Its unit is (micrometer)2.
4. For 5 micron technology, What is the Rs value for a metal?
a) 0.03
b) 0.04
c) 0.02
d) 0.01
Explanation: For a 5 micron technology, the Rs value for a metal is 0.03. It is the standard typical sheet resistance values
5. For 2 micron technology, what is the Rs value for polysilicon?
a) 10-40
b) 20-50
c) 15-30
d) 15-100
Explanation: For 2 micron technology, the Rs value for polysilicon is 15-30
6. Which has higher Rs values?
a) n-diffusion
b) p-diffusion
c) n-diffusion & p-diffusion
d) none of the mentioned
Explanation: The Rs values for p-diffusion is 2.5 times greater than that of the n-diffusion.
7. For 1.2 micron technology, what is the Rs value for diffusion?
a) 20-40
b) 20-45
c) 15-30
d) 25-50
Explanation: For 1.2 micron technology, the Rs value for diffusion is 20-45
8. What is the relationship between channel resistance and sheet resistance?
a) R = Rs
b) R = Z*Rs
c) R = Z/Rs
d) R = Rs/Z
Explanation:The relationship between channel resistance and sheet resistance can be given as R = Z*Rs. Sheet resistance is a measure of the resistance of thin films that are nominally uniform in thickness.
9. Z can be given as the ration of ___________
a) lower channel by upper channel
b) upper channel by lower channel
c) all of the mentioned
d) none of the mentioned
Explanation: Z (length to width) ratio can be given as the ratio of upper channel to lower channel. It is just a numerical quantity and has no unit.
10. Deposition of metal or silicon alloy can be done by ___________
a) sputtering
b) evaporation
c) sputtering and evaporation
d) deposition should not be made
Explanation: Deposition of metal or silicon alloy can be done by either sputtering or evaporation. Sputtering is a process whereby particles are ejected from a solid target material due to bombardment of the target by energetic particles.